Laser Micro-Hole Drilling Technology

21C has a technology to drill microholes that are difficult to implement in mechanical precision processors using the high energy of laser beams.

Technology Introduction

Due to the rapid development of the electronics and semiconductor industries and the dazzling development of the bio-medical industry that requires ultra-precision, ultra-precision processing technology that can process objects with a size of several μm is increasingly required.
Micromachining using a laser is a method of scribing and scribing a material with a particle size of several μm to several nm by using the high energy of a laser-beam to melt and evaporate the material in an instant without causing thermal damage to the material to be processed. It refers to processing such as cutting and drilling.

In general, for micromachining, a PicoSecond or FemtoSecond laser with a very short wavelength or a very short pulse width of a UV or Excimer laser, and an Ultra-Short Pulse laser are used. Ultra Short Pulse lasers including Excimer lasers are widely applied in ophthalmic vision correction, precision processing of glass and plastics, manufacturing of precision parts, earth science and astronomical research, and spectroscopy and FBG processes.

Most lasers used for micro-processing have very high pulse energy, peak output, and energy density, making it impossible to transmit laser-beam using optical cables. Skills in the precise handling of the material to be machined are also known to be important. Micro-processing technology is actively applied to the processing of ultra-precision parts, semiconductor fields, medical and bio fields, etc., and is mainly applied to glass cutting, ceramic cutting or drilling, and wafer cutting for semiconductors.

Introduction to drilling technology

Nanosecond IR Laser Femtosecond Green Laser
Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
Nanosecond IR Laser Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
input
output
Femto
second
Green Laser
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
  • Minimum hole size from 20 μm
  • Possible to process up to 0.3 μm apart from the hole
  • Vacuum plate for MLCC lamination
  • Possible to process up to 800,000 holes
  • Hole of various shapes
  • An irregular hole in the same section
  • Irregular size can be contained

Introduction of Femtosecond Laser Processing Characteristics

21century Technology system

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