Ultra-precision Processing Technology

We have 30 years of know-how and ultra-precision processing equipment for the production of ultra-precision processed products.

TECHNOLOGY INTRODUCTION

The demand for various precision parts such as semiconductor and camera module fields, MLCC production fields, various vacuum plates fields, and quantum computer components is continuously increasing throughout the industry. There are many companies with precision machining technology, but there are not many companies that respond to MCT/high-speed machining/laser machining/precision grinding/precision measurement with their own technology.
Therefore 21C is a company with these core technologies in line with the continuously increasing demand for high precision and high quality, and we are striving to become a core company for material, component and equipment of the 4th industry that always takes the lead in solving customer difficulties.
The precision equipment can be made by precision parts. As the best partner, we are supplying various precision parts so that our customers can conduct sustainable business.

MASKING JIG FOR MLCC PRODUCTION PROCESS

Mask Plate

Material : SK5(0.3t mm)
Application : Array Jig(Masking Jig)
Slot width : 0.075 ~ 0.31 mm
  • Masking Jig for sputter deposition during the MLCC manufacturing process
  • Groove width tolerance (+0.01) machining, deburring and flatness are important
  • High-speed processing using ultra-precision laser equipment
Material : SK5(0.3t mm)
Application : Array Jig(Masking Jig)
Slot width : 0.075 ~ 0.31 mm
  • Masking Jig for sputter deposition during the MLCC manufacturing process
  • Groove width tolerance (+0.01) machining, deburring and flatness are important
  • High-speed processing using ultra-precision laser equipment

MLCC INDEX TABLE

  • Ensure uniformity and high precision without limiting pocket shape
  • Same performance for entry/exit of MLCC generated from all pockets
  • High durability by using BLACK ZIRCONIA (density 6.05 g/㎤) material (resistance against tooth decay)
  • High mechanical properties and wear resistance
  • Advantages of 21C: Faster delivery / Lower price / Excellent quality compared to competitors

CERAMIC PARTS & CAMERA MODULE BONDING TOOL

Camera Module Bonding Tool
  • Production of precision ceramic parts for semiconductor and LCD parts
  • Produced index table for MLCC and various precision Jigs
  • Main material handling
    Alumina(Al2O3), Zirconia(White/Black ZrO2),
    Silicon nitride (Si3N4), Silicon carbide (SiC), Aluminum nitride (AlN), Porous ceramic (White/Brown/Gray)
Ceramic Parts
  • As an Attach Bonding Tool used in the process of bonding PCB and image sensor during the production process of camera module for mobile phone, high yield and precision are guaranteed.

  • Material : Alumina, AIN, Copper
  • Application : Pick-up and bonding tools for cameras module production.

QUANTUM COMPUTER PARTS

Ceramic blade : Quantum Computer Components Blade

Purpose

When the four blades have a symmetrical model, each atom can be separated and controlled with a qubit.

Role

The role of stably holding the qubit of the information unit
A part necessary for moving and holding atoms as desired through the blade-shaped micro slit and the space between the four blades

Technology

Korea’s only ceramic microgroove formation technology
Possesses blade-type ceramic cutting edge forming technology

ULTRA-PRECISION GRIPPER

Lens Gripper : Ultra-precision parts used for fiber array and lens alignment

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
https://www.youtube.com/channel/UCsdmghhdrzyS7b7yX6k_f9g
https://blog.naver.com/kim21ctt
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