Vacuum Plate

21C produces a variety of precision vacuum plates used in MLCC and semiconductor fields.

Vacuum Plate

The 21Century Co., Ltd. produces a variety of ultra-precise vacuum plates used in MLCC and semiconductor industries.
Because industrial vacuum plates have large suction holes, they can damage objects, and the demand for precision vacuum plates composed of micro holes is increasing. In the case of thin sheet-type products such as Film, a vacuum plate made of micro holes is needed because if the hole is large, the product may be damaged or embossed.

As a result, in the 21Century, high-precision vacuum plates consisting of micro holes from Ø0.1 to Ø0.03 are produced and supplied to various industrial area. Although the vacuum plate made of Porus Ceramic is widely used in the semiconductor field, it is unstable in high floor plan and uniform pressure management due to the size of the particles, and the importance of the vacuum plate of 21Century is emerging.
Although it varies depending on the size of the specification, we manufacture and provide the highest quality and performance vacuum plates for customers’ needs with 0.001 floor plan management and precise suction hole management up to Ø0.03.

The 21Century Vacuum Plate, which boasts high quality and performance, was selected as the next world-class product in 2023 and won the official brand certification of the Korean government as a leading product and company in the global market.

APPLICATION

Vacuum Plate
for Semidconductor Processing
Vacuum Plate
for Film
Vacuum Block
for Filp-Chip Processing
Vacuum Plate
MLCC lamination

FEMTOSECOND LASER VACUUM PLATE

  Nanosecond IR Laser Femtosecond Green Laser
  Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
Nanosecond IR Laser Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
input
output
Femto
second
Green Laser
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
  • Minimum hole size from 20 μm
  • Possible to process up to 0.3 μm apart from the hole
  • Vacuum plate for MLCC lamination
  • Possible to process up to 800,000 holes
  • Hole of various shapes
  • An irregular hole in the same section
  • Irregular size can be contained

VACUUM PLATE for MLCC production process

VACUUM PLATE
NAME Peeling plate
MATERIAL SU420J2, SKD11
APPLICATIONS For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine.
  • Micro-hole processing using a laser (possible to process up to Φ0.01 mm)
  • The shape of the microhole can be customized (circular, elliptical, square)
  • Unlike general drilling processing, laser processing always keeps the hole position constantly as the hole shall be processed after heat treatment.

VACUUM PLATE ELID Grinding Technology

ELID grinding technique (vacuum plate)

  • Increase the surface illumination of VACUUM PLATE and BLADE
  • Burr that occurs during grinding is reduced
  • Automation of manual dressing operations
Ra 0.018 ㎛ Ra 0.010 ㎛

Ultra-precise planar grinding processing with a plan view of 5 μm or less is possible

CORE TECHNOLOGY

Micro drilling Technology using Ultrashort-laser

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
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