Vacuum Plate

21C produces a variety of precision vacuum plates used in MLCC and semiconductor fields.
Industrial vacuum plates have large suction holes, which can damage objects, increasing the demand for precision vacuum plates composed of fine holes. If the hole is large, a thin sheet type product such as a film may be damaged or embossed, so a vacuum plate made of micro holes is required.

Therefore, 21C manufactures a high-precision vacuum plate consisting of fine holes from 00.1 to 0.00.03 and supplies it to industrial sites. Although Porous Ceramic is widely used in the semiconductor field, this is unstable in high flatness and uniform pressure management due to particle size, and thus the importance of 21C vacuum plates is emerging.
Although it varies depending on the size of the specification, the vacuum plate of the highest quality and performance is manufactured and provided according to customer needs with 0.001 plan management and precise suction hole management up to Ø0.03.

APPLICATION

Vacuum Plate
for Semidconductor Processing

Vacuum Plate
for Film

Vacuum Block
for Filp-Chip Processing

Vacuum Plate
MLCC lamination

FEMTOSECOND LASER VACUUM PLATE

	Nanosecond IR Laser	Femtosecond Green Laser
	Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz	Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz
input
output

Nanosecond IR Laser	Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz
input
output

Femto second Green Laser	Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz
input
output

Minimum hole size from 20 μm
Possible to process up to 0.3 μm apart from the hole
Vacuum plate for MLCC lamination
Possible to process up to 800,000 holes

Hole of various shapes
An irregular hole in the same section
Irregular size can be contained

VACUUM PLATE for MLCC production process

VACUUM PLATE

NAME	Peeling plate
MATERIAL	SU420J2, SKD11
APPLICATIONS	For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine.

Micro-hole processing using a laser (possible to process up to Φ0.01 mm)
The shape of the microhole can be customized (circular, elliptical, square)
Unlike general drilling processing, laser processing always keeps the hole position constantly as the hole shall be processed after heat treatment.