Vacuum Plate

21C produces a variety of precision vacuum plates used in MLCC and semiconductor fields.

Vacuum Plate

21C produces a variety of precision vacuum plates used in MLCC and semiconductor fields.
Industrial vacuum plates have large suction holes, which can damage objects, increasing the demand for precision vacuum plates composed of fine holes. If the hole is large, a thin sheet type product such as a film may be damaged or embossed, so a vacuum plate made of micro holes is required.

Therefore, 21C manufactures a high-precision vacuum plate consisting of fine holes from 00.1 to 0.00.03 and supplies it to industrial sites. Although Porous Ceramic is widely used in the semiconductor field, this is unstable in high flatness and uniform pressure management due to particle size, and thus the importance of 21C vacuum plates is emerging.
Although it varies depending on the size of the specification, the vacuum plate of the highest quality and performance is manufactured and provided according to customer needs with 0.001 plan management and precise suction hole management up to Ø0.03.

APPLICATION

Vacuum Plate
for Semidconductor Processing
Vacuum Plate
for Film
Vacuum Block
for Filp-Chip Processing
Vacuum Plate
MLCC lamination

FEMTOSECOND LASER VACUUM PLATE

  Nanosecond IR Laser Femtosecond Green Laser
  Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
Nanosecond IR Laser Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
input
output
Femto
second
Green Laser
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
  • Minimum hole size from 20 μm
  • Possible to process up to 0.3 μm apart from the hole
  • Vacuum plate for MLCC lamination
  • Possible to process up to 800,000 holes
  • Hole of various shapes
  • An irregular hole in the same section
  • Irregular size can be contained

VACUUM PLATE for MLCC production process

VACUUM PLATE
NAME Peeling plate
MATERIAL SU420J2, SKD11
APPLICATIONS For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine.
  • Micro-hole processing using a laser (possible to process up to Φ0.01 mm)
  • The shape of the microhole can be customized (circular, elliptical, square)
  • Unlike general drilling processing, laser processing always keeps the hole position constantly as the hole shall be processed after heat treatment.

VACUUM PLATE ELID Grinding Technology

ELID grinding technique (vacuum plate)

  • Increase the surface illumination of VACUUM PLATE and BLADE
  • Burr that occurs during grinding is reduced
  • Automation of manual dressing operations
Ra 0.018 ㎛ Ra 0.010 ㎛

Ultra-precise planar grinding processing with a plan view of 5 μm or less is possible

CORE TECHNOLOGY

Micro drilling Technology using Ultrashort-laser

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
https://www.youtube.com/channel/UCsdmghhdrzyS7b7yX6k_f9g
https://blog.naver.com/kim21ctt
/company/location/
/support/inquiry/