
21C produces a variety of precision vacuum plates used in MLCC and semiconductor fields.
Industrial vacuum plates have large suction holes, which can damage objects, increasing the demand for precision vacuum plates composed of fine holes. If the hole is large, a thin sheet type product such as a film may be damaged or embossed, so a vacuum plate made of micro holes is required.
Therefore, 21C manufactures a high-precision vacuum plate consisting of fine holes from 00.1 to 0.00.03 and supplies it to industrial sites. Although Porous Ceramic is widely used in the semiconductor field, this is unstable in high flatness and uniform pressure management due to particle size, and thus the importance of 21C vacuum plates is emerging.
Although it varies depending on the size of the specification, the vacuum plate of the highest quality and performance is manufactured and provided according to customer needs with 0.001 plan management and precise suction hole management up to Ø0.03.
Vacuum Plate for Semidconductor Processing |
Vacuum Plate for Film |
Vacuum Block for Filp-Chip Processing |
Vacuum Plate MLCC lamination |
Nanosecond IR Laser | Femtosecond Green Laser | |
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Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz |
Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz |
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Nanosecond IR Laser | Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz |
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Femto second Green Laser |
Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz |
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VACUUM PLATE |
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NAME | Peeling plate |
MATERIAL | SU420J2, SKD11 |
APPLICATIONS | For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine. |
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Ra 0.018 ㎛ | Ra 0.010 ㎛ |
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Ultra-precise planar grinding processing with a plan view of 5 μm or less is possible