Semiconductor Parts

21C manufactures and supplies various parts for semiconductor and semiconductor equipment industry based on precision processing technology.

Semiconductor Parts

21C manufactures and supplies various parts for semiconductor and semiconductor equipment industry based on precision processing technology.
Since there are so many different parts in the semiconductor field, there are cases where we do not know exactly where products manufactured in 21C are used in semiconductor facilities, so there are limitations in introduction.
Therefore, please consider that it can be produced in various ways in addition to the introduced materials.
Parts made of various materials, ranging from resin to steel, stainless steel, non-ferrous metal, hard metal, and ceramic, can be manufactured and supplied, so we would appreciate it if you could contact us anytime.

Content

01
Wafer Process
02
Oxidation process
03
Photo process
04
Etching process
05
Thin film process
06
Metal wiring process
07
EDS
08
Packaging
Wafer Process
01
Ingot making
02
Cutting the ingot
03
Polishing the wafer surface
04
Cleaning and inspection
Pre-process
Oxidation process
Dry oxidation
Wet oxidation
Pre-process
Photo process
01
Photoresist (PR) application
02
Exposure process
03
Development process
Pre-process
Etching process
Dry etching
Wet etching
Application
Focus Ring Wafer Chuck End Effector
Pre-process
Thin film process
Physical vapor deposition
Chemical vapor deposition
Plasma CVD
Pre-process
Metal wiring process
Aluminum thin film deposition
Cu damascene
Post-process
EDS process
01
EDS Test & WBI
02
Hot/Cold Test
03
Repair/Final Test
04
Inking
Application
Metal Carrier
  • Material : INVAR42
  • Metal carrier necessary for wafer protection in semiconductor wafer packaging process, 180℃ x 4hrs high temperature process
  • Requires high level of abrasive parallelism and ability to manage machining dimensions
Post-process
Packaging process
01
Wafer cutting
02
Chip adhesion
03
Metal connection
04
Plastic surgery
Application
Flip-chip Bonding Die Lead Frame TCB Bonding Tools
Automold Die Conventional Mold Retractable E-Pin Mold
Post-process
Packaging test
01
Defective screening
02
Enter your unique name
03
Determination of shipping method
04
Final shipment inspection
05
Product shipment
Application
Magazine Cassette

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
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