21Century Co.,Ltd. produces ultra-precision drilling products with laser processing.
Micro hole processing is capable of various types of materials such as PCD, PCBN, ceramic, cemented carbide, stainless steel, heat treated steel, and molybdenum.
Laser drilling refers to a technology that processes holes by rapidly applying heat to materials using high-power agglomerated laser beams to vaporize them.
This results in high-efficiency and high-quality hole processing. In particular, it is specialized in processing microholes of Ø0.2 or less.
Using the Femto-second Laser, Ø0.01mm of drilling can be implemented, and we are continuing to develop micron-class holes in smaller sizes.
Unlike general MCT drilling processes, laser processing has the advantage of easily processing holes after heat treatment, and thus it is possible to implement holes of constant quality even in products subjected to high strength, high hardness, or heat treatment.
| Vacuum Plate for Semiconductor Process |
Vacuum Plate for Film |
Vacuum Block for Filp-Chip Process |
Vacuum Plate for MLCC laminating |
Bonding Tools for Chip-on-Film |
Femto-Second Green Laser
Advanced Galvano Scanner
| Nanosecond IR Laser | Femtosecond Green Laser | |
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| Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz |
Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz |
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| Nanosecond IR Laser | Trepanning Drilling System – Power : 50 W, Pulse Energy : 100 uJ, Frequency : 100Hz |
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| Femto second Green Laser |
Advanced Helical Drilling System – Power : 5 W, Pulse Energy : 13 uJ, Frequency : 100Hz |
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| output |  |
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| VACUUM PLATE |
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| NAME | Peeling plate |
| MATERIAL | SU420J2, SKD11 |
| APPLICATIONS | For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine. |
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