Laser Drilling Products

21Century Co.,Ltd. produces ultra-precision drilling products with laser processing.
Micro hole processing is capable of various types of materials such as PCD, PCBN, ceramic, cemented carbide, stainless steel, heat treated steel, and molybdenum.

LASER DRILLING PRODUCTS

21Century Co.,Ltd. produces ultra-precision drilling products with laser processing.
Micro hole processing is capable of various types of materials such as PCD, PCBN, ceramic, cemented carbide, stainless steel, heat treated steel, and molybdenum.

Laser drilling refers to a technology that processes holes by rapidly applying heat to materials using high-power agglomerated laser beams to vaporize them.
This results in high-efficiency and high-quality hole processing. In particular, it is specialized in processing microholes of Ø0.2 or less.
Using the Femto-second Laser, Ø0.01mm of drilling can be implemented, and we are continuing to develop micron-class holes in smaller sizes.

Unlike general MCT drilling processes, laser processing has the advantage of easily processing holes after heat treatment, and thus it is possible to implement holes of constant quality even in products subjected to high strength, high hardness, or heat treatment.

APPLICATION

Vacuum Plate
for Semiconductor Process
Vacuum Plate
for Film
Vacuum Block
for Filp-Chip Process
Vacuum Plate
for MLCC laminating
Bonding Tools
for Chip-on-Film

Laser Drilling

Advanced Helical
Drilling Technology

Femto-Second Green Laser

+

Advanced Galvano Scanner

  • Nano(10⁻⁹) Second IR Laser → Femto(10⁻¹⁵) Second Green Laser
  • Trepanning Multi-Function → Advanced Helical Drilling

Introduction of femtosecond laser processing properties

FEMTOSECOND LASER VACUUM PLATE

Nanosecond IR Laser Femtosecond Green Laser
Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output
Nanosecond IR Laser Trepanning Drilling System – Power : 50 W,
Pulse Energy : 100 uJ, Frequency : 100Hz
input
output
Femto
second
Green Laser
Advanced Helical Drilling System – Power : 5 W,
Pulse Energy : 13 uJ, Frequency : 100Hz
input
output

 

  • Minimum hole Size up to 20 μm
  • Possible to process up to 3 μm apart from the hole
  • Vacuum plate for MLCC lamination
  • Possible to process up to 800,000 holes
  • Hole of various shapes
  • An irregular hole in the same section
  • Irregular size can be contained

 

VACUUM PLATE for MLCC production process

VACUUM PLATE
NAME Peeling plate
MATERIAL SU420J2, SKD11
APPLICATIONS For moving 0.8 microns of green ceramic sheet by vacuuming in MLCC stacking machine.
  • Micro-hole processing using a laser (possible to process up to Φ0.01 mm)
  • The shape of the microhole can be customized (circular, elliptical, square)
  • Unlike general drilling processing, laser processing always keeps the hole position constantly as the hole shall be processed after heat treatment.

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
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