Precision Laser Products

21C manufactures and supplies ultra-precision parts using Laser.
21C manufactures a variety of parts directly used in production lines in MLCC and semiconductor fields to parts of facilities.
In particular, 21C is specialized in the production that requires high-level flatness, general tolerance & geometric tolerance.

Precision Laser Products

21C manufactures and supplies ultra-precision parts using Laser.
21C manufactures a variety of parts directly used in production lines and the parts of facilities in MLCC or semiconductor fields.
In particular, 21C is specialized in the production that requires high-level flatness, general tolerance & geometric tolerance.

21C produces various high-quality precision parts based on 30 years experience of grinding, molding, drilling and laser processing technology and supplies to customers in various industries.

Any processing with laser, such as drilling, shaping, cutting, polishing, etc. is possible and there is no limitation on the material as it covers all of resin, metal, and ceramic.
In addition, it is not easy to find a business partner that perform not only production but assemble parts if necessary.
21C always do our best to be the best partner with all these conditions ready.

APPLICATION

Mask
Plate
MLCC
indextable
Precision
Nozzle
Precision
Pick-up Tools
Flip-chip
Die

Ultra-short laser precision processing technology

Ultra-short laser ultra-fine processing technology application

The ultra-fine processing technology of 21C

MLCC, Multi Layer Varistor, Multi Laser Actuator

Printed Circuit Board
(PCB)

Secondary battery
(cathode material, Anode material)

Display
(Light guide plate, optical film)

Smartphone
(Camera module)

Medical and bio

ULTRA-SHORT LASER ULTRA-FINE PROCESSING TECHNOLOGY APPLICATION

The ultra-fine processing technology of the 21st century

MLCC, Multi Layer Varistor, Multi Laser Actuator

Printed Circuit Board
(PCB)

Secondary battery
(Polar material, Anode material)

Display
(Light guide plate, optical film)

Smartphone
(Camera module)

(Entrance field)
Medical and bio
Electrical and electronic parts
Precision parts
Medical device

Flip-chip bonding die for semiconductor processing

A die consisting of 0.001 flat holes is required to solder after pick-up the die’s fine-sized solder ball used in the Flip-chip process.
Therefore, 21C manufactures and supplies Flip-chip dies consisting of 0.001 flat quality and Ø0.03 micro holes.

21century Technology system

If you have any questions or inquiries, please feel free to contact us.
https://www.youtube.com/channel/UCsdmghhdrzyS7b7yX6k_f9g
https://blog.naver.com/kim21ctt
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