21C processes and manages high-precision floor plans/right angles based on 30 years of processing technology, and based on this, it produces and supplies various high-precision Pick-up tools. 21C uses various materials such as hard metal, ceramic, and STS420J2 depending on the application for Pick-up tools.
Accordingly, 21C is optimized for precise processing of various materials.
The floor plan of Attach part is managed with some products 0.001 and is supplied to customers with the best quality.
| Camera Module Pick-up Tools | TCB Bonding Tools | Flip-chip Die | SMT Pick-up Tools | Ceramic Pick-up Finger |
| Camera Module Bonding Tool |
|---|
 |
| Machined surface of other companies’ ceramic tools | 21C Ceramic Tool Machined surface |
|---|---|
 |
 |
| The 21C ceramic tool completes the processing of the attachment line neatly through precision processing and precision grinding using high-speed processing equipment (MCT). The inner line of the attachment is related to the denting phenomenon, so high-level grinding technology is required. |
|
| 99.7% materials of other companies(ivory) | 21C 99.99% materials(white) |
|---|---|
 |
 |
| The 99.99% ceramic material of 21C has the advantage of very small particles and rare pores due to its ultra-high purity and ultra-fine powder, significantly lowering the sticking phenomenon, and ensuring a longer replacement cycle with strength and high hardness. | |
| Before dent prevention | After dent prevention |
|---|---|
 |
 |
| It has edge surface processing technology to prevent stamping, which is a chronic quality problem of ceramic tools and steel tools of the heating bonding type, and thus, bonding tools for camera modules manufactured in 21C rarely get stamped. | |
| Existing ceramic tool | 21C Ceramic Tool |
|---|---|
 |
 |
| The rest of the parts except for the attachment are made of copper to minimize heat loss and improve the tool function, and it is manufactured to maximize heat conduction through 21C bonding technology optimized for heating bonding type. | |
A die consisting of 0.001 flat holes is required to soler after pick-up the die’s fine-sized solder ball used in the Flip-chip process. Therefore, the 21st century manufactures and supplies Flip-chip dies consisting of 0.001 flat quality and Ø0.03 microholes.
