Laser Micro-Hole Drilling Technology

Due to the rapid development of the electronics and semiconductor industries and the dazzling development of the bio-medical industry that requires ultra-precision, ultra-precision processing technology that can process objects with a size of several μm is increasingly required.
Micromachining using a laser is a method of scribing and scribing a material with a particle size of several μm to several nm by using the high energy of a laser-beam to melt and evaporate the material in an instant without causing thermal damage to the material to be processed. It refers to processing such as cutting and drilling.

In general, for micromachining, a PicoSecond or FemtoSecond laser with a very short wavelength or a very short pulse width of a UV or Excimer laser, and an Ultra-Short Pulse laser are used. Ultra Short Pulse lasers including Excimer lasers are widely applied in ophthalmic vision correction, precision processing of glass and plastics, manufacturing of precision parts, earth science and astronomical research, and spectroscopy and FBG processes.

Most lasers used for micro-processing have very high pulse energy, peak output, and energy density, making it impossible to transmit laser-beam using optical cables. Skills in the precise handling of the material to be machined are also known to be important. Micro-processing technology is actively applied to the processing of ultra-precision parts, semiconductor fields, medical and bio fields, etc., and is mainly applied to glass cutting, ceramic cutting or drilling, and wafer cutting for semiconductors.