COF Bonding Tools

21C has succeeded in localizing Bonding Tools for Chip-On-Film, which relies on Japanese imports, and is producing and supplying them to customers.
This product requires ultra-precision processing technology and polishing technology of hard metal and PCD, and it requires the best processing technology to maintain a high-precision plan of 2um even at a high usage temperature of 400℃. It is not a product consisting of an imported S45C body and a PCD hard metal, but a product consisting of an integral body and a PCD attachment, and produces and supplies a long-lived COF bonding tool without deformation.

• COFPKG technology developed for Display Driver ICs, which have become more complex with the advent of high-performance displays, is a state-of-the-art package manufactured by combining semiconductor ICs and Film with electrical TEST processes.
• The 21st century localizes and supplies COF Bonding Tools, which is the core of COF PKG technology.
• Excellent flatness and lifespan are guaranteed even in the working environment at 400℃.