Vacuum Plate

It is a method of processing by using a laser when processing micro holes, and it is possible to process the size of micro holes up to Φ0.03mm. The shape of the fine hole can also be deformed. (Round, oval, square, etc.)

• Name
VACUUM PLATE

• Composition
Special steel used besidesSKD11

• Applications
For cutting and laminating ceramic  and electrode sheets  (0.8um thick)  when MLCC manufactured

• It is a method of processing by using a laser when processing micro holes, and it is possible to process the size of micro holes up to Φ0.03mm. The shape of micro holes can also be modified. (Circle, oval, square, etc.)
• Laser processing is different from drilling processing, so the hole is processed after heat treatment, so that the processing position of the fine hole is always kept constant. Drilling is heat treated after processing, so the distance between holes is not constant.
• For the above products, the perpendicularity, parallelism, and dimensional tolerance of the outside must be managed within 10㎛, and the top surface roughness of 0.4S~0.8S is required.
• In order to process the above products, precision processing technologies such as MCT processing, fine hole processing, surface grinding, plating, and related know-how are required.
• In order to manufacture high-capacity MLCCs in large quantities, the size of the VACUUM PLATE is also getting larger.